Innovations in Food Packaging, Shelf Life and Food Safety

15-17 September 2015 | Stadthalle Erding, Munich, Germany

In recent years, the development of novel food packaging methods and techniques has not only increased the shelf life of foods, but also improved their safety and quality. Innovations in Food Packaging, Shelf Life and Food Safety will provide a platform for delegates from industry and academia to discuss and develop new concepts and technologies required to advance the development of new packaging materials, explore technologies for food applications, and examine the influence of packaging materials on shelf life and food safety. The conference will also focus on food package sustainability, including bio-based packaging materials such as edible films which are the focus of new research.

Topics:

Food Packaging
  • Nano-packaging
  • New packaging materials and material development
  • Modified atmosphere, active and intelligent packaging
  • Aseptic packaging
  • Bio based and edible packaging, bioplastics
  • Food package testing
  • Food package Interactions: migration measurement methods, models and food safety risk assessment
  • Sustainable food contact materials
  • Recycling and Life Cycle Assessment
Shelf Life
  • Shelf Life methods, modelling, accelerated shelf life assessment
  • Sensory analysis: physiological and instrumental analysis
  • Off odors in food and packaging
  • Chemical, physical and microbial determinants for shelf life
  • Food quality assessment
  • Food safety assessment in a supply chain
  • Shelf life of foods with non-thermal and novel processing
Food Safety
  • Biological hazard risk assessment (Bacteria, fungi, viruses, allergens, parasites etc.)
  • Emerging pathogenic microorganisms, risk and prevention
  • Mathematical modelling of risk assessment
  • Food spoilage : biodiversity, characterization, risk assessment and inactivation
  • Physical and chemical hazards: measurement and assessment
  • Hygienic design and cleaning methods
  • Food laws and regulations

For more detail on topics covered, please visit the abstract submissions page.

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Organised by
 
  • Elsevier
  • Fraunhofer
Supporting Partners
 
  • Ehedg
  • ghi
  • Ivlv
  • Tum
Silver Sponsor
 
Bobst
Exhibitors
 
  • Abiss
  • Mocon